Employing such an active matrix backplane for the driver electronics allows image rendering with μLEDs to produce visualization scenarios with ultra-high resolution. Another work package will target processing concepts to enable rapid transfer of large quantities of μLED chips from a source wafer to the backplane driver electronics via automated parallel assembly. Key requirement here is a positioning accuracy of around 1.5 μm. Researching accurate transfer methods for such small chips (edge length smaller than 40 μm) will require entirely new technological approaches, which will be addressed within the project.
The SmartVIZ project is expected to complete in October 2021 when an initial demonstrator will be presented.
ASM AMICRA is an expert player in the field of production automation, especially in the high-tech area of photonic applications. The company brings its in-depth knowledge of micro assembly of photonic components to the project. The Fraunhofer Institute for Integrated Systems and Device Technology IISB specializes in power electronics and technologies for producing semiconductor devices. IISB will design and manufacture transparent electronic circuits for their final installation in micro-pixel visualization components.
Hubert Halbritter, SmartVIZ project leader at Osram Opto Semiconductors, described his company’s role, “as a project partner with in-depth experience in micro-pixel imaging components that will research efficient, high-luminance pixels. Along with our partners, we aim to gain technology leadership in one of the key future technology markets.”
Osram - www.osram-os.com