OLED's barrier films and thin film encapsulation: IDTechEx's review: Page 6 of 6

July 25, 2019 //By Julien Happich
barrier film
Flexible and foldable high-performance barrier or encapsulation technology had long represented a technology challenge. The industry spent a decade and a half optimizing the approaches and the processes to achieve large-area production-grade results.

The emerging, challenger, technologies must unseat the incumbent to get in. The current process has proved adequate for Gen6 plastic rigid OLED displays. It has the benefit of higher maturity, accumulated learning and sunk investment in production assets. It will also be adopted in the first generation of bendable displays. But will it retain its leading position as the technology transitions towards tighter bending angles?

Will it also become the technology of choice for emerging producers seeking a more accessible technology option? Will it provide the means to scale-up beyond Gen6?

IDTechEx’ report “Barrier Films and Thin Film Encapsulation for Flexible and/or Organic Electronics 2019-2029” provides an up-to-date analysis of various encapsulation technologies such as inline thin film encapsulation (TFE), multi-layer barrier films, single-layer spatial atomic layer deposited thin films, flexible glass, and so on. It considers the various applications such as rigid, plastic rigid and flexible OLED displays, OLED lighting, quantum dot enhancement films, organic photovoltaics and other flexible photovoltaic technologies.

IDTechEx - www.IDTechEx.com

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