Industrial temperature-grade 25G DFB lasers target 5G LTE wireless fronthaul

September 10, 2018 // By Julien Happich
Macom Technology Solutions has developed a new portfolio of 25G distributed feedback (DFB) lasers designed for use in next-generation 5G LTE wireless fronthaul infrastructure.

Available in bare die chip format (1xxD-25I-LCT11-50x) and TO-packaging (1xxD-25I-LT5xC-50x), the new are designed for operation in the -40 to 85ºC temperature range over transmission distances from 2 to 10km. The new 25G lasers will meet stringent operating requirements while helping to expand wireless infrastructure bandwidth for high-speed 5G connectivity. The devices leverages Macom’s proprietary Etched Facet Technology (EFT), which the company claims could enable breakthrough cost efficiencies and product uniformity at commercial scale manufacturing levels. The industrial temperature-grade 25G lasers are sampling to customers today, with production availability planned for 2019.

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