Chipset enables 200G and 400G optical modules

September 11, 2018 // By Julien Happich
Macom has developed what the company claims to be the industry’s first complete chipset solution for 200G and 400G CWDM optical module providers servicing Cloud Data Center applications.

This solution enables 200G modules at under 4.5W and 400G modules at under 9W total power consumption. Macom’s full transmit and receive solution operates at up to 53 Gbps PAM-4 data rates per lane and is optimized for use in 200G QSFP56 and 400G QSFP-DD and OSFP module applications. For 200G demonstration, the solution is comprised of the MAOM-38051 four-channel transmit CDR and modulator driver and MAOT-025402 TOSA with embedded MAOP-L284CN CWDM L-PIC (silicon photonic integrated circuit with integrated CW lasers) transmitter, and on the receive side features the MAOR-053401 ROSA with embedded de-multiplexer, BSP56B photodetectors MATA-03819 quad TIA and the MASC-38040 four-channel receive CDR. The combined, high-performance MACOM solution enables a low bit error rate (BER) and better than 1E-8 pre-forward error correction (Pre-FEC).

Macom -  www.macom.com


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